Last modified Aug. 27, 2001
Submission : Oct. 30, 2000
Scheduled delivery : Feb. 26, 2001
Ceramic packaged chip was delivered on Feb. 2001. (x1)
Plastic packeged chip was delivered on Aug. 27 2001. (x20)
Die delivered.
Digital chip paid Jan 13, 2001.
This chip includes following circuit.
This chip includes following circuit.